JPH02106874U - - Google Patents
Info
- Publication number
- JPH02106874U JPH02106874U JP1404989U JP1404989U JPH02106874U JP H02106874 U JPH02106874 U JP H02106874U JP 1404989 U JP1404989 U JP 1404989U JP 1404989 U JP1404989 U JP 1404989U JP H02106874 U JPH02106874 U JP H02106874U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- bonding pad
- wire bonding
- inner layer
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1404989U JPH02106874U (en]) | 1989-02-10 | 1989-02-10 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1404989U JPH02106874U (en]) | 1989-02-10 | 1989-02-10 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02106874U true JPH02106874U (en]) | 1990-08-24 |
Family
ID=31224894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1404989U Pending JPH02106874U (en]) | 1989-02-10 | 1989-02-10 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02106874U (en]) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6057999A (ja) * | 1983-09-09 | 1985-04-03 | 日本電気株式会社 | 多層配線板 |
JPS61154152A (ja) * | 1984-12-21 | 1986-07-12 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 電子装置用ハウジング |
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1989
- 1989-02-10 JP JP1404989U patent/JPH02106874U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6057999A (ja) * | 1983-09-09 | 1985-04-03 | 日本電気株式会社 | 多層配線板 |
JPS61154152A (ja) * | 1984-12-21 | 1986-07-12 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 電子装置用ハウジング |